2V 350MA 0.67W CERAMIC3030 70-100LM 620-632NM SMD LED CHIP FOR Medical Illumination Photo Therapy
superior robustness, high reliability, long lifetime, low thermal resistance. Perfectly addressing applications demanding for high efficiency and long lifetime requirement SMT ceramic package with silicone lens
Radiation: 80° ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B) Luminous Flux: typ. 85 lm Luminous efficacy: typ. 115 lm/W
Maximum Ratings
Parameter Symbol Values
| Operating Temperature | Top | min. max. | -40 °C 125 °C |
| Storage Temperature | Tstg | min. max. | -40 °C 125 °C |
| Junction Temperature | T | max. | 135 °C |
| Forward current | I | min. max. | 100 mA 1000 mA |
| Surge Current t ≤ 10 µs; D = 0.005 ; TJ = 25 °C | FS | max. | 1500 mA |
| Reverse voltage 2) | V | | Not designed for reverse operation |
| ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B) | ESD | | 8 kV |
Characteristics
I = 700 mA; TJ = 25 °C
Parameter Symbol Values
| Peak Wavelength | λpeak typ. 6340 nm |
| Centroid Wavelength 3) I = 350 mA | λdom min. 620 nm typ. 623 nm max. 632 nm |
| | |
| Spectral Bandwidth at rel,max | ∆λ typ. 16 nm |
| Viewing angle at 50% IV | 2φ typ. 80 ° |
| Forward Voltage 4) I = 350 mA | 1.8V 2.00V 2.30V |
| Reverse current 2) | Not designed for reverse operation |
| Electrical thermal resistance junction/solderpoint with efficiency ηe = 74 % | RthJS elec. typ. 2.5 K / W |
Forward Voltage Groups
Group Forward Voltage 4)
I = 350 mA
| 70 lm | 75 lm |
| 75 lm | 82 lm |
| 82 lm | 90 lm |
| 90 lm | 100 lm |
Centroid
Group
Centroid Wavelength 3)
I = 350 mA
λcentroid
Relative Spectral Emission
Irel = f (λ); IF = 350 mA; TJ = 25 °C
Radiation Characteristics
Irel = f (ϕ); TJ = 25 °C
Dimensional Drawing
Further Information:
Approximate Weight: 28.0 mg
Package marking: Anode
Corrosion test:Class: 3BTest condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter than IEC 60068-2-43)
ESD advice: The device is protected by ESD device which is connected in parallel to the Chip.
Reflow Soldering Profile
Product complies to MSL Level 2 acc. to JEDEC J-STD-020E
Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit
Minimum Recommendation Maximum
| Ramp-up rate to preheat*) 2 25 °C to 150 °C | 3 | K/s |
| tS 60 100 T to T | 120 | s |
| Ramp-up rate to peak*) T to T 2 | 3 | K/s |
| Liquidus temperature TL 217 | | °C |
| Time above liquidus temperature tL 80 | 100 | s |
| Peak temperature T 245 | 260 | °C |
| Time within 5 °C of the specified peak 10 20 temperature TP - 5 K | 30 | s |
| Ramp-down rate* 3 T to 100 °C | 6 | K/s |
| Time 25 °C to TP | 480 | s |
All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
Product Tags:
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Micro 2v Ceramic 3030 70-100lm 620-632nm SMD LED Chip For Medical Illumination Images
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